Epoxy Resin Artisanal Excellence: Hand Lay-up Molding Process for Superior Product Quality

• Customization: Available
• CAS No.: 1675-54-3
• Bonding Function: High Temperature Resistant Adhesive
• Model NO.: Hand lay-up molding process
• Main Agent Composition: Epox Resin
• Characteristic: Solvent-Free
• Color: Clear
• Curing Condition: Room Temperature Curing
• Transport Package: 25kg/Drum
• Trademark: Sinopec
• Origin: Hunan
• HS Code: 3506912000
• Production Capacity: 3000000

Product Description

Product Description

The hand lay-up molding process, also known as contact low-pressure molding process, is one of the earliest process methods used. Hand lay-up molding process is to add the resin mixture with curing agent as the matrix, with glass fiber or carbon fiber and its fabric as the reinforcing material, in the mold coated with mold releasing agent to lay up the combination by hand, manufacturing fiberglass reinforced plastic products.

Product recommendation

AH-1A/B
product Features:

1.Suitable viscosity

2.Fast curing at room temperature

3.Good wettability with fibers

4.High reinforcing strength
 

system series

Hand lay-up resin system series

Items	Proportion	Mixing viscosity (25ºC, cp)	Applicable period(25ºC, min)	Glass transfer temperatureTg(ºC)	Product  characteristics
AH-1A/B	100:50	1000-1500	40-50	>70	Carbon fiber impregnation adhesive, good wettability with fiber
AH-2A/B	100:90	400-800	40-60	------	Highly elastic system with high toughness
AH-3A/B	100:10	20000-25000	20-30	>100	High-tack structural adhesives for metal-to-metal, metal-to-composite and composite-to-composite adhesives

* Formulation can be adjusted according to the actual application.

 

Structural adhesive product

The Most Highly Recommended Product in Structural AdhesivesAH-3A/B
Product Features:
1.Suitable viscosity
2.Fast curing at room temperature
3.High adhesion strength to metal
4.Good strength and fatigue resistance

Detailed product parameters:

Items	AH-3A/B
A/B proportion	100:10
Mixing viscosity(40ºC,cp)	9000-14000
Gelation time(25ºC,min)	20-30
Glass transfer temperatureTg(ºC)	>100

Corporate strengths